Promwad partners with Asian chip vendors to offer cost-effective electronic designs in Europe

VILNIUS, Lithuania, 2017-Aug-04 — /EPR ELECTRONICS NEWS/ — Promwad Electronics Design House has partnered with leading technological fabless companies in China and Southeast Asia to offer its clients cost-effective electronics product development from the center of Europe and to manufacture any batch size of new devices with priority tech support.

Promwad was one of only a few design houses in the EMEA region authorized by Allwinner, one of the leading Chinese chip manufacturers. Promwad’s engineers design electronics based upon Allwinner components and provide tech support during the entire life cycle of the designed devices:

  • tablet PCs, multimedia and portable devices based on Allwinner SoC A series;
  • TV set-top boxes with OTT and IPTV based on Allwinner SoC H series;
  • dash cameras, video cameras and action cameras based on Allwinner SoC V series;
  • onboard multimedia systems for vehicles based on Allwinner SoC T series.

Allwinner was founded ten years ago; its headquarters are based in Zhuhai, Guangdong, China. In 2013 and 2014 this chip vendor was the world’s largest supplier of application processors for Android tablets.

Also Promwad became an official partner of Telink, Shanghai, and has significantly expanded its expertise in the fields of Bluetooth and BLE. This chip vendor specializes in Bluetooth and Zigbee for IoT and wearable electronics, remote controls, smart lighting and smart toys.

The engineers of Promwad have a lot of experience with the most popular chipsets of other vendors: TI CC265x, Silabs EFR32 Blue Gecko, Nordic nRF, Qualcomm/CSR10xx, and Dialog DA1458x. And now Telink TLSR826x BLE SoC has been added to this list; this system on chip has low power consumption, supports Zigbee, 6LoWPAN/Thread, and HomeKit.

Promwad maintains cooperation with the company Realtek from Taiwan and uses its chips to design network equipment from CPE – routers, gateways, WiFi hotspots to operators-side telecom equipment such as unmanaged and managed switches.

“Today the center of the semiconductor industry’s innovations and manufacture is shifting to Asia. Traditional chip vendors from the USA and Europe face growing competition from this region. Our customers demand functional and cost effective solutions to be designed at closer location such as Belarus or Lithuania and manufactured in Asia, that’s why establishing close links with Asian chip makers is a natural step for us,” says Ivan Kuten, the Business Developer of Promwad. “Namely by using such cooperation we cover our most growing capabilities in tablets, consumer gadgets, STB, CPE and multimedia devices. Now our customers in the EU and North America can create new hi-tech devices with controlled costs, tech support in English and manufacturing facilities in Europe or Asia.”

Contact-Details: Olga Potonya
+370 (5) 214 12 44 ex.227


Via EPR Network
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LSP Technologies is now filling its schedule for laser peening app development in Europe

Dublin, OH, Aug-01-2017 — /EuropaWire/ — LSP Technologies (LSPT) is now filling its schedule for laser peening application development in Europe. This landmark opportunity coincides with the impending delivery of LSPT’s Procudo® 200 Laser Peening System to the ZAL Center of Applied Aeronautical Research (ZAL Zentrum für Angewandte Luftfahrtforschung) in Hamburg, Germany. Beginning in 2018, LSPT is making the Procudo® System available to European manufacturers for laser peening research and application development.

Key features of the Procudo® 200 Laser Peening System:

• Production-quality system engineered for high-volume laser peening
• Diode-pumped, pulsed YLF laser delivers high beam quality for consistent processing
• Fastest (20 Hz) and most powerful (200 W) pulsed laser peening equipment available in the world
• Real-time diagnostics and selectable beam parameters for comprehensive process control

“This is the first opportunity for many European manufacturers to access an industrial laser peening system for application and product development research,” said David Lahrman, VP of Business Development for LSPT. “We’re introducing a superior fatigue enhancement solution to the European market, and we’re excited to form new partnerships in pursuit of stronger, more reliable components.”

Laser shock peening (LSP) is a powerful metal improvement process that produces a 10X fatigue life enhancement over shot peening. LSP utilizes a high-energy pulsed laser to generate controlled stress waves that impart compressive residual stresses up to 12 mm beneath the material surface. Laser peening has been proven to significantly extend the service life of metal parts by providing enhanced resistance to common failure mechanisms:

• Fatigue Cracking
• Stress Corrosion Cracking
• Foreign Object Damage
• Fretting Fatigue
• Creep Deformation
• Erosion

Laser peening improves the performance and reliability of metal components, adding value to critical parts across a broad range of industries:

• Aviation and Aerospace – Engine components, turbine blades, bulkheads, wing attachments, landing gear, helicopter components
• Automotive – Axles, drive shafts, valve stems, connecting rods, pistons, impellers
• Medical – Orthopedic implants, replacement joints, spinal fixation devices
• Power Generation – Land-based turbine blades and components, nuclear containment vessels, wind turbine gears
• Manufacturing – Metal forming dies, machine tools

LSP Technologies’ newest laser peening facility will reside in the heart of the Hamburg Aviation Cluster at the ZAL Center of Applied Aeronautical Research. The ZAL TechCenter is one of the largest and most advanced aeronautical research facilities in the world, offering an innovative research space for collaborative development of emerging technologies.

Companies looking to improve the fatigue strength and performance capabilities of their parts should contact LSP Technologies regarding access to the Hamburg laser peening facility. Highly trained technicians will work alongside OEM researchers to develop custom applications addressing specific material performance issues.

SOURCE: EuropaWire